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Reflow oven pcb9/19/2023 ![]() ![]() The user interface is cleaner and easier to use. This modification results in a better user experience. This is a potential safety hazard.Īnalysis result: Recommend you check the grounding. Several owners reported that these machines are not grounded or not grounded well. If the analysis of the modification concluded that the modification would be done, there is more information related to the implementation below in the Implementations section. Modifications ConsideredĪfter reviewing a fair amount of the available information, the following list of modifications was considered the most important. Each technique is tested for its benefit or lack thereof and then refined. He considers several different techniques for improving the performance. He uses professional-grade equipment to monitor the temperature distribution across the over during the entire heating cycle. He is exquisitely detailed in his investigations. On Jerry Walker's YouTube channel he does an entire series on his investigations on the performance of his oven. The videos make a nice companion to the written steps on the Github page. It is also very useful to see him step through things like upgrading his firmware. The videos have some useful checks and modifications not on the Github page. On Seon's YouTube he has a series of three videos on his T-962A. The Github page contains the source code and binaries as well as instructions and notes on other modifications that have been reported helpful. Unified Engineering created new firmware for the ovens. An overview is given here and the links can be found in the page Links section. I narrowed the list down to what I believe are the three critical ones that anyone wanting to modify these ovens should consult. There are many good sources of information available on these ovens. The text listed it as “2020 New version" and the exhaust port in the back is also different.Ī link to what I purchased can be found in the Links section. I found two ways to spot the newer version. The new version seems to have corrected some of the issues with the older style. The “A” version costs a little more, but gave a far better chance of success, so that's what I chose.įurther reading and I found out that there was an updated model of the T-962A. If an oven doesn’t have enough power, there isn’t much you can do. The larger “A” model has no shortage of issues, but it seemed like more people were having success (after a few modifications). Many reported that the smaller model just barely had enough power to reflow, at best. It has 4 heating elements as opposed to the two on the smaller model. The two ovens T-962 and T-962A are very similar with the main difference being that the “A” version is more powerful. This meant having a baseline of knowledge and not having to discover it on my own. I initially narrowed down the options to the T-962/T-962A mostly based on the large amount of information available. Reflow profiles or processes that are not well optimised can lead to poor or non-wetting, damaged components or cold soldering.Īfter soldering the boards are inspected in detail.There are a handful of small reflow oven options. The processed board is cooling down in the last zones of the reflow oven, the solder alloy solidifies and makes the solder joints. The component that has the lowest maximum temperature allowance will define the maximum temperature. This maximum temperature must remain under the maximum allowed temperature of the components. In the third section the solder paste is melted and the process reaches its maximum temperature. ![]() ![]() The Temperature gradient is important because too quick changes of temperature can cause damage to components.ĭuring the thermal soak the flux is activated to reduce oxidation of pads and leads of components and improve wetting. The aim of the preheating stage is to accumulate heat smoothly in the board and the components. Reflow solder profiles usually have four stages, preheat, thermal soak, reflow and cooling. The solder profile is influenced by the number of layers in the PCB, the copper distribution on the board, the number and size of components. Solder profiles need to be optimised for each individual assembly job. Multiple segments help to get an optimised heat transfer and minimum temperature differences between different points on the PCBA. These are long convection ovens with many heating zones that together create a soldering cycle.Įach heating zone of the oven has a regulated temperature set to the solder profiles for the assembly process. The solder paste melts during this process and cools down again to create a good solder joint. During the Pick & Place operation, components are glued to the board by the solder paste.Ī reliable connection is made during the reflow soldering process. ![]()
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